Package Development

The optimal package is not available for every LED application. We develop with you your specific solution for your application for each platform and component:

• Leadframe: PPA, white epoxy mold compounds, silicone-based mold compounds
• Substrates: MCB or ceramic
• Interconnect: silver conductive adhesives, eutectic soldering and silver pastes
• Potting / molded lenses: epoxies and silicones
• LED chips in cooperation with Chips4Light

In addition to assistance with design and material selection, we can help you develop robust manufacturing processes. If desired, the complete LED can also be offered in cooperation with Chips4Light.