Semiconductor packaging

mold compound







Shin-Etsu has been developing materials around semiconductor manufacturing for over 40 years. You too can benefit from the advantages of mature materials:

  • Epoxy Mold Compounds for Standard and High Temperature Applications
  • Thermally conductive epoxy-based mold compounds
  • Green Mold Compounds and Mold Compounds without Postcure
  • Underfills / Sidefills