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Package Development

Not every LED application can be served by the market.

We develop together with you the suitable solution for your application, for any platform and any component of your LED:

  • Leadframe: PPA, white epoxy mold compounds, silicone based mold compounds
  • Substrate: Leadframe type, MCB or ceramic
  • Interconnect: silver filled epoxy, eutectic die attach and silver sinter paste
  • Encapsulant / Lens: epoxy and silicone
  • LED Chip: in cooperation with Chips4Light


We offer support for design and material choice and help you to develop robust production processes. On your request, we can offer the complete LED in cooperation with Chips4Light.

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